Felder bar solder S-Sn99Cu1
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FELDER Solder Bar S-Sn99Cu1 (lead-free)
- Delivery quantity = 1 bar (250g)
Lead-free solder bar for soft soldering copper, copper alloys, and tinned/nickel-plated components. The tin/copper alloy Sn99/Cu1 offers good wetting, robust solder joints, and reliable results in workshops, production, and maintenance.
Advantages
- Proven lead-free Sn99/Cu1 alloy – reliable, resilient solder joints.
- Melting range 227–310 °C – controlled flow behavior depending on heat input.
- Good wetting performance on copper and common copper alloys.
- Suitable for solder baths, re-tinning, and manual rework.
Typical applications
- Plumbing/Heating/HVAC: Soft soldering of copper pipes and fittings (with suitable flux).
- Electrical/Electronics: Re-tinning, repair, maintenance of solder baths.
- Metal construction/Precision mechanics: Cu, CuSn, CuZn as well as tinned/nickel-plated surfaces.
Processing instructions
- Prepare components to be metallically clean and grease-free.
- Use suitable flux (not included); remove residues depending on type.
- Temperature control: at least above 227 °C, practically 260–320 °C depending on component mass.
- Protect solder bath from oxidation (covering agents/skimming); plan regular bath maintenance.
- Ensure ventilation, observe PPE.
Technical Data
Technical Data
Product details
Product details
Choose welding technology based on material, process, performance, and location. For questions regarding accessories, wear parts, or alternatives, we are happy to help.
Notes & Application
Notes & Application
Before use, observe the operating instructions, protective measures, and manufacturer's specifications. Use suitable consumables and regularly check wear parts.
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